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Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 |
가혹환경에서 FBGA 패키지의 흡습물성 및 이온 마이그레이션 신뢰성 평가 = Evaluation of hygroscopic properties and reliability for ionic migration of FBGA packages under harsh conditionlink 최종국; Choe, Jong-Guk; et al, 한국과학기술원, 2013 |
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