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A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06 |
과냉 액체 질소를 이용한 급속 냉각 과정에서의 열전달 현상에 대한 실험적 연구 = Experimental study on the heat transfer phenomena in rapid cooling process with subcooled liquid nitrogenlink 김도운; Kim, Do-Woon; et al, 한국과학기술원, 2000 |
회전하는 극저온 시스템의 열설계와 단열 특성에 관한 실험적 연구 = Thermal design and experimental investigation of the rotating cryogenic systemlink 이창규; Lee, Chang-Gyu; et al, 한국과학기술원, 2000 |
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