Showing results 1 to 17 of 17
A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03 |
Cryogenic strength of adhesive bridge joints for thermal insulation sandwich constructions Yoon, Soon Ho; Kim, Ki Hyun; Lee, Dong Young; Lee, Dai Gil, COMPOSITE STRUCTURES, v.111, pp.1 - 12, 2014-05 |
Depth dependence of ultraviolet curing of organosilicate low-k thin films Kim, Taek-Soo; Tsuji, Naoto; Kemeling, Nathan; Matsushita, Kiyohiro; Geisler, Holm; Zschech, Ehrenfried; Dauskardt, Reinhold H., JOURNAL OF APPLIED PHYSICS, v.103, no.6, 2008-03 |
Elongation improvement of transparent and flexible surface protective coating using polydimethylsiloxane-anchored epoxy-functionalized siloxane hybrid composite for reliable out-foldable displays Lee, Hyunhwan; Lee, Yung; Lee, Sun Woo; Kang, Seung-Mo; Kim, Yun Hyeok; Jo, Woosung; Kim, Taek-Soo; et al, COMPOSITES PART B-ENGINEERING, v.225, 2021-11 |
Enhanced cleaning of photoresist film on a transparent substrate by backward irradiation of a Nd : YAG laser Kim, JH; Suh, YJ; Kim, Sang Soo, APPLIED SURFACE SCIENCE, v.253, no.4, pp.1843 - 1848, 2006-12 |
Erbium-doped and Raman microlasers on a silicon chip fabricated by the sol-gel process Yang, L; Carmon, T; Min, Bumki; Spillane, SM; Vahala, KJ, APPLIED PHYSICS LETTERS, v.86, no.9, 2005-02 |
Improvement of the adhesive peel strength of the secondary barrier with level difference for LNG containment system Yoon, Soon-Ho; Kim, Ki-Hyun; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.95, pp.528 - 538, 2013-01 |
Laser-Induced Hydrothermal Growth of Heterogeneous Metal-Oxide Nanowire on Flexible Substrate by Laser Absorption Layer Design Yeo, Junyeob; Hong, Sukjoon; Kim, Gunho; Lee, Habeom; Suh, Young Duk; Park, Inkyu; Grigoropoulos, Costas P.; et al, ACS NANO, v.9, no.6, pp.6059 - 6068, 2015-06 |
Optimization and reliability evaluation of COG bonding process Jeong, Young Hun; Jung, Seung-Won; Jin, Songwan; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.30, no.3, pp.1305 - 1313, 2016-03 |
Optimum Silane Treatment for the Adhesively Bonded Aluminum Adherends at the Cryogenic Temperature Kim, Jin-Gyu; Park, Sang-Wook; Yoon, Soon-Ho; Lee, Dai-Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.24, no.4, pp.775 - 787, 2010 |
Physical modeling and analysis of microlens formation fabricated by a modified LIGA process Kim, DS; Yang, SS; Lee, SK; Kwon, TH; Lee, Seung Seob, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.13, pp.523 - 531, 2003-09 |
Pressure-resisting capability of the knot area of the primary barrier for a LNG containment system Lee, Dongyoung; Kim, Ki Hyun; Choi, Ilbeom; Lee, Dai-Gil, OCEAN ENGINEERING, v.95, pp.128 - 133, 2015-02 |
Robust optimization of a tandem grating solar thermal absorber Choi, Jongin; Kim, Mingeon; Kang, Kyeonghwan; Lee, Ikjin; Lee, Bong Jae, JOURNAL OF QUANTITATIVE SPECTROSCOPY RADIATIVE TRANSFER, v.209, pp.129 - 136, 2018-04 |
Role of acoustic phonon transport in near- to asperity-contact heat transfer Jarzembski, Amun; Tokunaga, Takuro; Crossley, Jacob; Yun, Jeonghoon; Shaskey, Cedric; Murdick, Ryan A; Park, Inkyu; et al, PHYSICAL REVIEW B, v.106, no.20, 2022-11 |
Structural Color Generation on Transparent and Flexible Substrates by Nanosecond Laser Induced Periodic Surface Structures Arthanari, Srinivasan; Park, Jong-Eun; Bose, Sivakumar; Kang, Hyun Wook; Kim, Sanha; Yang, Minyang; Lee, Huseung; et al, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.10, 2023-05 |
Uniform Coating of Self-Assembled Noniridescent Colloidal Nanostructures using the Marangoni Effect and Polymers Lee, Seung Yeol; Kim, Hyoungsoo; Kim, Shin-Hyun; Stone, Howard A., PHYSICAL REVIEW APPLIED, v.10, no.5, pp.054003, 2018-11 |
Universal selective transfer printing via micro-vacuum force Park, Sang Hyun; Kim, Tae Jin; Lee, Han Eol; Ma, Boo Soo; Song, Myoung; Kim, Min Seo; Shin, Jung Ho; et al, NATURE COMMUNICATIONS, v.14, no.1, 2023-11 |
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