Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject Flexible electronics
Showing results 1 to 10 of 10
| Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02 |
| Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature Jo, Woosung; Lee, Tae-Ik; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.130, 2022-03 |
| Experimental study on spreading and evaporation of inkjet printed pico-liter droplet on a heated substrate Lim, Taewoong; Han, Sewoon; Chung, Jaewon; Chung, Jin Taek; Ko, Seung Hwan; Grigoropoulos, Costas P., INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.52, no.1-2, pp.431 - 441, 2009-01 |
| Fabrication of submicron-sized metal patterns on a flexible polymer substrate by femtosecond laser sintering of metal nanoparticles Son, Y.; Yeo, J.; Ha, C.W.; Hong, S.; Ko, S.H.; Yang, Dong-Yol, INTERNATIONAL JOURNAL OF NANOMANUFACTURING, v.9, no.5-6, pp.468 - 476, 2013 |
| Intrinsic Bauschinger Effect and Recoverable Plasticity in Pentatwinned Silver Nanowires Tested in Tension Bernal, Rodrigo A.; Aghaei, Amin; Lee, Sangjun; Ryu, Seunghwa; Sohn, Kwonnam; Huang, Jiaxiang; Cai, Wei; et al, NANO LETTERS, v.15, no.1, pp.139 - 146, 2015-01 |
| Liquid-assisted adhesion control of graphene-copper interface for damage-free mechanical transfer Kang, Sumin; Yoon, Taeshik; Ma, Boo Soo; Cho, Min Sun; Kim, Taek-Soo, APPLIED SURFACE SCIENCE, v.551, pp.149229, 2021-06 |
| Study on mechanical reliability of flexible display structure considering multiple neutral planes = 다중 중립면을 고려한 플렉서블 디스플레이 구조의 기계적 신뢰성에 관한 연구link Kim, Wansun; 김완선; et al, 한국과학기술원, 2016 |
| 나노물질의 선택적 레이저소결을 이용한 유연전기소자 구현 연구현황 Ko, Seung Hwan, TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS, B, v.35, no.5, pp.533 - 538, 2011-05 |
| 유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰 김철규; 이태익; 김택수, 마이크로전자 및 패키징학회지, v.23, no.2, pp.19 - 28, 2016-06 |
| 전류 환경 아래에서 유연 전극 박막의 전기-기계적 특성 연구 = Electro-mechanical characteristics of flexible conductive film on polymer substrate under electric currentlink 장동원; Jang, Dong-Won; et al, 한국과학기술원, 2017 |
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