Showing results 1 to 2 of 2
Chip warpage model for reliability prediction of delamination failures Yang, Se Young; Kwon, Woon-Seong; Lee, Soon-Bok, MICROELECTRONICS RELIABILITY, v.52, no.4, pp.718 - 724, 2012-04 |
THE COOLING OF A HEAT-GENERATING BOARD INSIDE A PARALLEL-PLATE CHANNEL BEJAN, A; MOREGA, AM; LEE, SW; Kim, SungJin, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.14, no.2, pp.170 - 176, 1993-06 |
Discover