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Showing results 1 to 8 of 8

1
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

2
Chip warpage model for reliability prediction of delamination failures

Yang, Se Young; Kwon, Woon-Seong; Lee, Soon-Bok, MICROELECTRONICS RELIABILITY, v.52, no.4, pp.718 - 724, 2012-04

3
Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes

Jang, Kyung-Lim; Kim, Sanwi; Jeong, Byeong-Heon; Oh, Jong-Gil; Hong, Bo Ki; Kim, Taek-Soo, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.42, no.16, pp.11644 - 11653, 2017-04

4
Microstructure arrays of DNA using topographic control

Cha, Yun Jeong; Park, Soon Mo; You, Ra; Kim, Hyoungsoo; Yoon, Dong Ki, NATURE COMMUNICATIONS, v.10, 2019-06

5
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07

6
Reliability-oriented optimal design of intentional mistuning for a bladed disk with random and interval uncertainties

Yoo, David; Lee, IkJin; Tang, J, ENGINEERING OPTIMIZATION, v.49, no.5, pp.796 - 814, 2017-05

7
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

8
Three-Dimensional Interlocking Interface: Mechanical Nanofastener for High Interfacial Robustness of Polymer Electrolyte Membrane Fuel Cells

Yuk, Seongmin; Choo, Min-Ju; Lee, Dongyoung; Guim, Hwanuk; Kim, Tae-Ho; Lee, Dai Gil; Choi, Sungyu; et al, ADVANCED MATERIALS, v.29, no.2, 2017-01

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