Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Ryu, Hyun Jun
Showing results 1 to 6 of 6
| Chemical-Mechanical Polishing of a Soft Pad Asperity with Protective Hard Thin Film Ryu, Hyun Jun; Kim, Dong Geun; Kang, Sukkyung; Jeong, Ji-hun; Kim, Sanha, International Symposium on Precision Engineering and Sustainable Manufacturing (PRESM2020), Korean Society for Precision Engineering (KSPE), 2020-11-15 |
| Evaluation of Polishing Performance by CMP Pad with Bi-layered Asperities Ryu, Hyun Jun; Kim, Sanha; Jeong, Ji-hun; Kim, Dong Geun, International Conference on Planarization Technology, ICPT 2022, ICPT, 2022-10-28 |
| Mechanical Abrasion by Bi-layered Pad Micro-Asperity in Chemical Mechanical Polishing Ryu, Hyun Jun; Kim, Dong Geun; Kang, Sukkyung; Jeong, Ji-hun; Kim, Sanha, CIRP ANNALS-MANUFACTURING TECHNOLOGY, v.70, no.1, pp.273 - 276, 2021-07 |
| Mechanical Abrasion by Bi-Layered Pad Micro-Asperity in Chemical Mechanical Polishing Ryu, Hyun Jun; Kim, Dong Geun; Kang, Sukkyung; Jeong, Ji-hun; Kim, Sanha, CIRP Annals 2021, CIRP, 2021-08-25 |
| Superhydrophobicity of elastocapillary engineered re-entrant CNT topography for self-enrichment assisted femto-molar molecular sensing Kim, Seong Jae; Jeong, Ji-hun; Ryu, Hyun Jun; Yang, Inyeong; Kim, Dong Geun; Son, Jihyuk; Kim, Sanha, The 19th International Nanotech Symposium & Exhibition (Nanokorea 2021), Korea Nanotechnology Research Society., 2021-07-07 |
| 패드 단일미세돌기 접촉점에서의 화학적기계연마 연마성능 분석 및 개선 방안 = Study on characterization and improvement of CMP performance at single contact point of pad micro-asperitylink 류현준; 김산하; et al, 한국과학기술원, 2021 |
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