Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Lee, Jae-Hak
Showing results 1 to 6 of 6
| A new wafer level TSV build-up stacking using oxide bonding Kim, Sun-Rak; Song, Jun-Yeob; Lee, Seung-Seob; Lee, Jae-Hak, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.23, no.6, 2013-06 |
| Design of Highly Uniform Spool and Bar Horns for Ultrasonic Bonding Kim, Sun-Rak; Lee, Jae-Hak; Yoo, Choong-Don; Song, Jun-Yeob; Lee, Seung-Seob, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.58, no.10, pp.2194 - 2201, 2011-10 |
| Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die Kim, Sun-Rak; Lee, Phil-Lip; Lee, Jae-Hak; Song, Jun-Yeob; Yoo, Choong-Don; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1048 - 1054, 2012-06 |
| Spin-on glass를 이용한 실리콘과 유리의 저온 접합 공정 = Low temperature bonding process of silicon and glass using spin-on glasslink 이재학; Lee, Jae-Hak; et al, 한국과학기술원, 2005 |
| 나노구조체 전극을 이용한 고성능 에너지저장소자 제작에 관한 연구 = (A) study on fabrication of high-performance energy storage devices using nanostructured electrodelink 이재학; 양민양; et al, 한국과학기술원, 2018 |
| 플라즈마 디스플레이 패널(PDP)의 비접촉식 형광막 프린팅 공정에 관한 연구 = (A) study on non-contact printing process for phosphor layer deposition of PDPlink 이재학; Lee, Jae-Hak; et al, 한국과학기술원, 2009 |
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