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1
An In-Process Measurement Technique Using Laser for Non-Contact Monitoring of Surface Roughness and Form Accuracy of Ground Surfaces

Lee, C.S.; Kim, Seung-Woo; Yim, D.Y.; Tönshoff, H.K., CIRP ANNALS - MANUFACTURING TECHNOLOGY, v.36, no.1, pp.425 - 428, 1987

2
Bandwidth Analysis of a Microgyroscope vibrating in two orthogonal axes on the substrate plane

Hong,Y.S.; Lee, J.H,; Lee, C.S.; Jang,W.I.; Choi, C.A.; Kim, Soohyun; Kwak, Yoon Keun, SPIE International Symposium on Design, Test, and Microfabrication of MEMS and MOEMS, 1999, pp.939 - 947, SPIE, 1999-03

3
Modeling and Analysis of for a High Speed Cam-Follower Mechanism of Power Circuit Breaker

Ahn, K.Y.; Kang, K.R.; Lee, C.S.; Choe, J.W.; Kim, Soohyun; Kwak, Yoon Keun, Asia-Pacific Vibration Conference, pp.55 - 59, 1997-11-09

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