Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Kim, Kyung Min
Showing results 1 to 6 of 6
| Advanced Cu/Polymer Hybrid Bonding System for Fine-Pitch 3D Stacking Devices Park, Juseong; Kang, Sukkyung; Kim, Myeong Eun; Kim, Nam Jun; Kim, Jungkyun; Kim, Sanha; Kim, Kyung Min, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.20, 2023-10 |
| Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding Kim, Myeongeun; Kang, Sukkyung; Kim, Sanha; Kim, Kyung Min, The 7th International Conference on Advanced Electromaterials, ICAE 2023, International Conference on Advanced Electromaterials(ICAE), 2023-11-02 |
| Plasma-Assisted CMP for Planarization of Adhesive Polymers in 3D Stacked Semiconductor Devices Kang, Sukkyung; Park, Juseong; Jeon, Chan Su; Kim, Kyung Min; Kim, Sanha, International Conference on Planarization/CMP Technology, ICPT 2023, International Conference on Planarization Technology (ICPT), 2023-11-01 |
| Polymer/Cu hybrid CMP process for high-reliability of Cu direct bonding Park, Juseong; Kim, Sanha; Kang Sukkyung; Kim, Kyung Min, Electronic Materials and Nanotechnology for Green Environment (ENGE) 2022, The Korean Institute of Metals and Materials, 2022-11-06 |
| Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09 |
| Self-pressure regulating CMP process for hybrid Cu/polymer bonding Kang, Sukkyung; Park, Juseong; Kim, Kyung Min; Kim, Sanha, 3rd Korea-Tribology International Symposium, K-TRIB2023, Korean Tribology Society, 2023-04-05 |
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