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Showing results 1 to 4 of 4

1
Detection of Graphene Cracks By Electromagnetic Induction, Insensitive to Doping Level

Yoon, Taeshik; Kang, Sumin; Kang, Tae Yeob; Kim, Taek-Soo, CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES, v.120, no.2, pp.351 - 361, 2019-08

2
On-Chip Canary Circuit Design for Electronic Interconnects by Utilizing RF Resonance Peak Movement as a Prognostic Factor

Kang, Tae Yeob; Seo, Donghwan; Kim, Taek-Soo, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08

3
Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis

Kang, Tae Yeob; Seo, Donghwan; Min, Joonki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.6, pp.990 - 998, 2021-06

4
Reliability assessment on electronic interconnects by S-parameter pattern analysis = S파라미터 패턴 분석을 이용한 전기적 인터커넥트의 신뢰성 평가link

Kang, Tae Yeob; Kim, Taek-Soo; et al, 한국과학기술원, 2022

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