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Inspection of ball grid array (BGA) solder joints using X-ray cross-sectional images Roh Y.J.; Ko K.W.; Cho, Hyungsuck; Kim H.C.; Joo H.N.; Kim S.K., Proceedings of the 1999 Machine Vision Systems for Inspection and Metrology VIII, v.3836, pp.168 - 178, International Society for Optical Engineering (SPIE), 1999-09-21 |
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