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Showing results 1 to 6 of 6

1
Effects of cooling rates on material behaviors of solder alloys

Lee, Soon-Bok; Hwang, Tae-Kyung, IMAPS-Korea 추계 기술 심포지움, pp.24 - 24, 2004

2
Material Characterization of Lead-Free Solder Materials

Lee, Soon-Bok; Hwang, Tae-Kyung, KAIST-Tokyo Tech Joint Workshop, 2004

3
Mechanicsl behavior of lead-free solder materials with various microstructures

Lee, Soon-Bok; Hwang, Tae-Kyung, Tokyo Tech-KAIST joint workshop, pp.24 - 25, 2005

4
Numerical Analysis of Coined Eutectic Solder Bumps

Hwang, Tae-Kyung; Nah, Jae-Woong; Paik, Kyung-Wook; Lee, Soon-Bok, KSME 2002 Conference of Materials and Fracture Division, KSME 02MF025, pp.158 - 163, 2002

5
무연 소더에서의 재료 거동 및 열피로 특성에 대한 미세 구조 영향 = Effects of microstructure on material behaviors and fatigue properties of lead-free solder materialslink

황태경; Hwang, Tae-Kyung; et al, 한국과학기술원, 2007

6
실시간 모아레 측정을 이용한 소더조인트의 열피로 변형 해석에 관한 연구 = A study on the solder joint deformation analysis under thermal cycling by the real-time moire measurementlink

황태경; Hwang, Tae-Kyung; 엄윤용; 이순복; et al, 한국과학기술원, 1999

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