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Showing results 1 to 8 of 8

1
A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications

Ki, Seokkan; Lee, Jooyoung; Ryu, Seunggeol; Bang, Soosik; Kim, Kichong; Nam, Youngsuk, INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v.161, 2021-03

2
An energy-efficient battery thermal management system incorporating a porous metal-based multiscale flow manifold

Ki, Seokkan; Lee, Jooyoung; Kim, Seungwoo; Seong, Jeongmo; Shim, Jaehwan; Oh, Seungtae; Cho, Sumin; et al, ENERGY CONVERSION AND MANAGEMENT, v.269, 2022-10

3
Corrosion resistance of water repellent aluminum surfaces with various wetting morphologies

Song, Kyounghwan; Kim, Inkyu; Bang, Soosik; Jung, Jung-Yeul; Nam, Youngsuk, APPLIED SURFACE SCIENCE, v.467, pp.1046 - 1052, 2019-02

4
Enhanced capillary and heat transfer performance of asymmetric micropost wicks

Bang, Soosik; Kim, Jeonghwan; Ryu, Seunggeol; Ki, Seokkan; Heo, Yun Jung; Lee, Choongyeop; Nam, Youngsuk, INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, v.146, 2023-07

5
Optimizing Energy-Efficient Jet Impingement Cooling Using an Artificial Neural Network (ANN) Surrogate Model for High Heat Flux Semiconductors

Kim, Seungwoo; Ki, Seokkan; Bang, Soosik; Han, Sanghyung; Seo, Junyong; Ahn, Chulmin; Maeng, Suhyeon; et al, APPLIED THERMAL ENGINEERING, v.239, 2024-02

6
Porous liquid metal-based phase change materials with suppressed supercooling for sustainable thermal regulation of electronic devices

Ki, Seokgan; Shin, Sungjong; Cho, Soomin; Bang, Soosik; Choi, Donghwi; Nam, Youngsuk, The 21st International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2023-10-27

7
Superhydrophilic catenoidal aluminum micropost evaporator wicks

Bang, Soosik; Ryu, Seunggeol; Ki, Seokkan; Song, Kyounghwan; Kim, Jinwook; Kim, Joongnyon; Nam, Youngsuk, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.158, 2020-09

8
Thermal Management in EV Inverters: Optimizing Jet Impingement Cooling with Micropost Integration

Kim, Seungwoo; Ki, Seokgan; Bang, Soosik; Han, Sanghyung; Seo, Junyong; Ahn, Chulmin; Maeng, Suhyeon; et al, The 21st International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2023-10-27

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