Showing results 1 to 1 of 1
Ultralow-k Amorphous Boron Nitride Film for Copper Interconnect Capping Layer Kim, Kiryong; Kim, Hyeongjoon; Lee, Sun-Woo; Lee, Min Yung; Lee, Gyusoup; Park, Youngkeun; Kim, Heetae; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.5, pp.2588 - 2593, 2023-05 |
Discover