Showing results 12 to 13 of 13
Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
Discover