Showing results 4 to 5 of 5
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
열변형 충격에 의한 텔레비전 마찰소음 저감에 관한 연구 = Reduction of frictional impulse noise induced by thermomechanical deformations in TV setslink 표준호; Pyo, Joon-Ho; et al, 한국과학기술원, 2005 |
Discover