Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject JOINTS
Showing results 27 to 33 of 33
| Peel strength improvement of foam core sandwich beams by epoxy resin impregnation on the foam surface Lee, CS; Lim, TS; Kwon, JW; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.5, pp.687 - 701, 2003 |
| Semi-active vibration control of space truss structures by friction damper for maximization of modal damping ratio Park, Young-min; Kim, Kwang-joon, JOURNAL OF SOUND AND VIBRATION, v.332, no.20, pp.4817 - 4828, 2013-09 |
| Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
| Smart cure cycle for reducing the thermal residual stress of a co-cured E-glass/carbon/epoxy composite structure for a vanadium redox flow battery Nam, Soohyun; Lee, Dongyoung; Choi, Ilbeom; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.120, pp.107 - 116, 2015-02 |
| Surface modification of carbon fiber/epoxy composites with randomly oriented aramid fiber felt for adhesion strength enhancement Choi, Ilbeom; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.48, pp.1 - 8, 2013-05 |
| Trenchless repairing of underground pipes using RTM based on the axiomatic design method Chin, WS; Kwon, JW; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.37, no.12, pp.1109 - 1126, 2003 |
| Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Soo; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03 |
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