Showing results 5 to 8 of 8
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 |
Reliability-oriented optimal design of intentional mistuning for a bladed disk with random and interval uncertainties Yoo, David; Lee, IkJin; Tang, J, ENGINEERING OPTIMIZATION, v.49, no.5, pp.796 - 814, 2017-05 |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
Three-Dimensional Interlocking Interface: Mechanical Nanofastener for High Interfacial Robustness of Polymer Electrolyte Membrane Fuel Cells Yuk, Seongmin; Choo, Min-Ju; Lee, Dongyoung; Guim, Hwanuk; Kim, Tae-Ho; Lee, Dai Gil; Choi, Sungyu; et al, ADVANCED MATERIALS, v.29, no.2, 2017-01 |
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