Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Paik, KW
Showing results 7 to 13 of 13
| Nemerical Analysis of Coined Eutectic Solder Bumps Lee, Soon-Bok; Hwang, TK; NAH, JW; Paik, KW, KSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, pp.158 - 163, 2002 |
| Numerical Simulation of the Formation of Coined Solder Bump Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001 |
| Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
| Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
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