Showing results 1 to 4 of 4
Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate Kim, Cheolgyu; Lee, Tae-ik; Choi, Hyesun; Kim, Min-Sung; Kim, Taek-Soo, 64th Electronic Components and Technology Conference, pp.1004 - 1009, Electronic Components and Technology Conference(ECTC), 2014-05-29 |
Power-based performance comparison between carbon dioxide and R125 transcritical cycles for a low-grade heat source Baik, Young-Jin; Kim, Min-Sung; Chang, Ki-Chang; Kim, Sung-Jin, APPLIED ENERGY, v.88, no.3, pp.892 - 898, 2011-03 |
개선된 수준구조를 이용한 유한요소 강성행렬의 밴드폭 최소화 방법 연구 = A new algorithm for the minimization of the bandwidth of the finite element stiffness matrix using improved level structurelink 김민성; Kim, Min-Sung; et al, 한국과학기술원, 1994 |
유한요소법을 이용한 분자 시스템의 전자 밀도 계산에 관한 연구 = Finite element calculation of the electron densities of molecular systemslink 김민성; Kim, Min-Sung; 윤성기; 강정구; et al, 한국과학기술원, 2006 |
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