Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 668
Showing results 88 to 147 of 177
| Implementation of Thermo-Viscoplastic Constitutive Equations into the Finite Element Code ABAQUS Youn, SS; Lee, Soon-Bok; Kim, JB; Lee, HY; Yoo, B, Structural Mechanics in Reactor Technology, International SMiRT15, 1999 |
| Influence of Pre-straining on low cycle fatigue Behaviorof 316L Stainless steel in Dynamic strain aging regime Lee, Soon-Bok, , 2003 |
| Influence of strain rate on tensile and LCF properties of prior cold worked 316L stainless steel in dynamic strain aging regime Hong, SG; Lee, Soon-Bok, First International Conference on Fatigue Damage of Materials Experiment and Analysis, Fatigue Damage of Materials, pp.137 - 147, 2003-07-14 |
| Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases Park, TS; Lee, Soon-Bok, 52nd Electronic Components and Technology Conference, pp.979 - 984, 2002-05-28 |
| Low cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints Lee, Soon-Bok; Park, TS, TMA Conference, 2003 |
| Low-cycle fatigue behavior of cyclically non-stabilized 316L stainless steel : Influence of temperature Lee, Soon-Bok; Hong, Seong-Gu, 2004 KSME confernece of Materials and Fractures Division, KSME04MF33, pp.196 - 201, 2004 |
| Low-Cycle Fatigue life prediction using Tomkins Model Lee, Soon-Bok; Lee, Keum-Oh, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Material Characterization of Lead-Free Solder Materials Lee, Soon-Bok; Hwang, Tae-Kyung, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Material Characterization of Thin Film in MEMS Structures Lee, Soon-Bok, Micro- Nano (includes Bio-) Technology, UM-KAIST Joint Workshop, pp.1 - 20, 2004 |
| Measurement of Mechanical Properties of Electroplated Nickel Thin Film for MEMS Application Back, DC; Park, TS; Lee, Soon-Bok; Lee, NK; Choi, TH; Na, KH, KSME 2003 Spring Conference, 2003 |
| Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001 |
| Measurement of Thermal Deformations of Electronic packages using Moire Interferometry Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000 |
| Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, SEM'04, 2004 |
| Measurement of Thermomechanical Behavior of Solder Joints under Power cycling Condition Using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition Ham, Suk-Jin; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.323 - 327, 2001 |
| Mechanical Behavior of Metallic Submicron Film on Polyimide Substrate:Stress Analysis and Experimental Techniques Lee, Soon-Bok; Baek, Dong Cheon, Tokyo Tech-KAIST joint workshop, pp.58 - 59, 2005 |
| Mechanical behavior of metallic thin film on polyimide substrate Baek, Dong-Cheon; Kim, Sung-Yeol; Lee, Soon-Bok, ECF16, pp.370 -, 2006 |
| Mechanical behavior of submicron metallic thin film on polymer substrate:stress analysis and tensile testing Lee, Soon-Bok; Baek, Dong-Cheon; Kim, Sung-Yeol, 2005 KSME spring conference, 05S016, pp.10 - 10, 2005 |
| Mechanical Fatigue Tests of Solder Joints under Mixed-Mode Loading Cases Park, Tae-Sang; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.438 - 443, 2001 |
| Mechanical Properties of Thin Film for MEMS Application Lee, Soon-Bok; Baek, Dong-Cheon; Park, Tae-Sang, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Mechanical Reliability of Electronics Packaging Lee, Soon-Bok; Ham, SJ, pp.3 - 45, 2001 |
| Mechanicsl behavior of lead-free solder materials with various microstructures Lee, Soon-Bok; Hwang, Tae-Kyung, Tokyo Tech-KAIST joint workshop, pp.24 - 25, 2005 |
| Mechanicsl Bending Fatigue Reliability Using a Electromagnetic Actuator Lee, Soon-Bok; Kim, Ilho, Tokyo Tech-KAIST joint workshop, pp.72 - 73, 2005 |
| Micromecanical Testings for Reliability of Electronic Packaging Lee, Soon-Bok; Ham, Suk-Jin, ICMAT2001, 2001 |
| Micromechanical Testing for Fatigue Reliability of Electronic Packaging Lee, Soon-Bok; Ham, SJ, Int. Conf. on ADVANCED TECHNOLOGY IN EXPERIMENTAL MECHANICS, ATEM'97, pp.355 - 360, 1997 |
| Model for prediction of Fatigue crack closure load considering roughness-induced closure and plsticity-induced closure Lee, Soon-Bok; Kim, JH, KSME 2000 Conference of Materials and Fracture Division KSME 00MF064, pp.136 - 141, 2000 |
| Modeling of Materials Behavior of HIP Superalloys for Liquid Rocket Engine Turbopump Applications Lee, Soon-Bok; Lee, KO; Bae, KH; Yoon, SH; Jeon, SM; Kim, J, IVK, ULB,European Conference for Aerospace Science (EUCASS), 2007 |
| Nemerical Analysis of Coined Eutectic Solder Bumps Lee, Soon-Bok; Hwang, TK; NAH, JW; Paik, KW, KSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, pp.158 - 163, 2002 |
| Numerical Analysis of Coined Eutectic Solder Bumps Hwang, Tae-Kyung; Nah, Jae-Woong; Paik, Kyung-Wook; Lee, Soon-Bok, KSME 2002 Conference of Materials and Fracture Division, KSME 02MF025, pp.158 - 163, 2002 |
| Numerical Simulation of the Formation of Coined Solder Bump Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001 |
| On a Crack Problem of Fretting Fatigue Lee, Soon-Bok; Lee, BH; Kim, HK; Seo, KS; Sohn, DS, Asian Pacific Conference for Fracture and Strength'96, (APCFS'96), pp.203 - 208, 1996 |
| Out-of-Phase, Combined bending and torsion fatigue of steels Lee, Soon-Bok, Biaxial and Multiaxial Fatigue, pp.623 - 641, 1989 |
| Oxidation assisted fatigue crack growth in modified 9Cr-Mo Steel at elevated temperature Lee, Soon-Bok; Lee, H.Y.; Lee, J.H., International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics 2014, 2014-11-17 |
| Positive energy method in life prediction of gray cast iron and spheroidal cast iron at elevated temperatures Lee, Soon-Bok; Lee, KO, Fatigue Damage of Structural Materials VII, 2008 |
| Prediction of Thermomechanical Behavior of the AISI316L Stainless Steel Yoon, S; Hong, SG; Lee, Soon-Bok, ASTM Thermomechancal Fatigue Behavior of Materials, pp.16 - 17, 2001 |
| Profiles of self stress and load stress at notches Fuchs, HO; Lee, Soon-Bok, Fatigue '87, pp.1009 - 1018, 1987 |
| Random Thermomechanical Fatigue Deformations Analysis Lee, Keum-Oh; Lee, Soon-Bok, International Conference on Fatigue Damage of Structural Materials, 2006 |
| Rayleigh Wave Transmission Characteristics of Continuous Caasting Slab for Medium Carbon Steel Lee, Soon-Bok; Lee, Jun-Youn, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Real-time reliability monitoring system in electronic package by using interferometric moire Park, Jin-Hyoung; Lee, Soon-Bok, 2006 KSME Spring Conference, 2006-06 |
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, I; Lee, Soon-Bok, IEEE Transactions on Components and Packaging Technologies, pp.478 - 484, 2005 |
| Reliability Assessment of Advanced Electronics Packaging and MEMS(Key-Note Speech) Lee, Soon-Bok, Tokyo Tech-KAIST joint workshop, pp.3 - 4, 2005 |
| Reliability assessment of advanced materials and structures Lee, Soon-Bok, APCMM09, 2009-11 |
| Reliability assessment of BGA solder joints under cyclic bending loads Kim, Ilho; Lee, Soon-Bok, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32, 2005-12-11 |
| Reliability Assessment of Electronic Packaging and Thin Film Lee Soon-Bok, ICMR2011(International Conference on Materials Reliability 2011), KSME, 2011-11 |
| Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics Lee, Soon-Bok; Kim, Ilho, APCOM'07 in conjunction with EPMESC XI, 2011-08-12 |
| Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics Lee, Soon-Bok, 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), 2014-07-22 |
| Reliability Assessment of Electronics Packaging with Fringe Pattern Analysis Lee, Soon-Bok; Ham, Suk-Jin, ICEM05, pp.17 -, 2005 |
| RELIABILITY ASSESSMENT OF LEAD-FREE SOLDER JOINTS IN ELECTRONICS PACKAGING Lee, Soon-Bok, UKC 2008, 2008 |
| Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods Lee, Soon-Bok; Ham, SJ, Workshop on Flip Chip Packaging, 1999 |
| Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads Kim, IH; Lee, Soon-Bok, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.64 - 71, 2006 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Reliability Evaluation of Solder joints in Electronics Packaging Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002 |
| Simulation of Fatigue-Creep Damage of Type 304 Stainless Steel at Elevated Temperature Lee, Soon-Bok; Woo, YS; Kim, JY, Fatigue '93, pp.927 - 932, 1993 |
| Strength evaluation of excavator components for integrity under fatigue loading confitions Lee, Soon-Bok; Lee, SH, Fatigue '90, pp.2123 - 2128, 1990 |
| Stress profiles at notches for fatigue strength improvements Lee, Soon-Bok, Asian-Pacific Congress of Strength Evaluation '89, (APCS'89), pp.611 - 616, 1989 |
| Stretchability of silver nanoparticle thin film on polymer substrate for printed electronics applications Won, Sejeon; Kim, Sanghyeok; Sim, Gi-Dong; Park, Inkyu; Hong, Seong-Gu; Lee, Soon-Bok, 2012년도 신뢰성부문 춘계학술대회, pp.176 - 177, KSME(대한기계학회) 신뢰성부문, 2012-04 |
| Stretchability of Silver Thin Film Deposited on Polymer Substrate under Electrical Current Condition Jang, Dong Won; Hong, Seong Gu; Lee, Soon Bok, ICMR2015, International Conference on Materials and Reliability, 2015-11-23 |
| Structural Fatigue test of Automobile Components under constant amplitude loading Lee, Soon-Bok, Proc. of ASM Fatigue, Fracture, Failure Analysis Symposium, pp.177 - 186, 1985 |
| Structural fatigue testing of the lower body frame of an excavator Lee, Soon-Bok; Joo, Ch; Lee, SH, Proceedings of the 1991 SEM Spring Conference on Experimental Mechanics, 1991 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
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- 4,093 2020 - 2024
- 12,322 2010 - 2019
- 10,774 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989