Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject JOINTS
Showing results 16 to 33 of 33
| Effect of Surface Roughness on the Adhesive Strength of the Heat-Resistant Adhesive RTV88 Cho, Tae Min; Choo, Yeon Seok; Lee, Min Jung; Oh, Hyeon Cheol; Lee, Byung Chai; Park, Tae Hak; Shin, Young Sug, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.23, no.15, pp.1875 - 1882, 2009 |
| Evaluation of mechanical interlock effect on adhesion strength of polymer-metal interfaces using micro-patterned surface topography Kim, Won-Seock; Yun, Il-Han; Lee, Jungju; Jung, HeeTae, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.30, no.6, pp.408 - 417, 2010-09 |
| Failure characterization of laser welds under combined loading conditions Ha, J.; Huh, Hoon, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.69, pp.40 - 58, 2013-04 |
| Flame and silane treatments for improving the adhesive bonding characteristics of aramid/epoxy composites Kim, Jin-Gyu; Choi, Il-Beom; Lee, Dai-Gil; Seo, Il-Sung, COMPOSITE STRUCTURES, v.93, no.11, pp.2696 - 2705, 2011-10 |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04 |
| Improvement of the adhesive peel strength of the secondary barrier with level difference for LNG containment system Yoon, Soon-Ho; Kim, Ki-Hyun; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.95, pp.528 - 538, 2013-01 |
Influence of Tensile Speeds on the Failure Loads of the DP590 Spot Weld under Various Combined Loading Conditions Song, Jung Han; Huh, Hoon, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2015 |
| Mechanically fastened composite side-door impact beams for passenger cars designed for shear-out failure modes Lim, TS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.56, no.2, pp.211 - 221, 2002-05 |
| Numerical analysis of the damage behavior of an aluminum/CFRP hybrid beam under three point bending Shin, Dong Kil; Kim, Hee Chul; Lee, Jungju, COMPOSITES PART B-ENGINEERING, v.56, pp.397 - 407, 2014-01 |
| On the computation of the near-tip stress intensities for three-dimensional wedges via two-state M-integral Lee, Y; Im, Seyoung, JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, v.51, no.5, pp.825 - 850, 2003-05 |
| Optimization and reliability evaluation of COG bonding process Jeong, Young Hun; Jung, Seung-Won; Jin, Songwan; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.30, no.3, pp.1305 - 1313, 2016-03 |
| Peel strength improvement of foam core sandwich beams by epoxy resin impregnation on the foam surface Lee, CS; Lim, TS; Kwon, JW; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.5, pp.687 - 701, 2003 |
| Semi-active vibration control of space truss structures by friction damper for maximization of modal damping ratio Park, Young-min; Kim, Kwang-joon, JOURNAL OF SOUND AND VIBRATION, v.332, no.20, pp.4817 - 4828, 2013-09 |
| Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
| Smart cure cycle for reducing the thermal residual stress of a co-cured E-glass/carbon/epoxy composite structure for a vanadium redox flow battery Nam, Soohyun; Lee, Dongyoung; Choi, Ilbeom; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.120, pp.107 - 116, 2015-02 |
| Surface modification of carbon fiber/epoxy composites with randomly oriented aramid fiber felt for adhesion strength enhancement Choi, Ilbeom; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.48, pp.1 - 8, 2013-05 |
| Trenchless repairing of underground pipes using RTM based on the axiomatic design method Chin, WS; Kwon, JW; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.37, no.12, pp.1109 - 1126, 2003 |
| Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Soo; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03 |
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