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Elastic region of an ACF joint for thermosonic flip-chip bonding Ha, Chang-Wan; Jang, Tae-Young; Kim, Kyung-Rok; Yun, Won-Soo; Kim, Kyung-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.9, 2011-09 |
Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
소형 로봇의 효율적 구동을 위한 신개념 공압 생성 및 구동 메커니즘 연구 = Design of novel gas generation and actuation mechanism for efficient driving of small robotslink 김경록; 김경수; et al, 한국과학기술원, 2018 |
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