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The Influence of Microstructure Change on Thermal Fatigue Life of Solder Ball Lee, Soon-Bok; Ryu, Jong-Eun; Hwang, TK, Tokyo Tech-KAIST joint workshop, pp.52 - 53, 2005 |
(The) influence of reflow profile on the thermal fatigue behaviors of BGA solder joint = 리플로 프로파일이 BGA 소더 조인트의 열적 피로 특성에 미치는 영향link Ryu, Jong-Eun; 류종은; et al, 한국과학기술원, 2006 |
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