DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, SP | - |
dc.contributor.author | Choi, Si-Kyung | - |
dc.contributor.author | Park, Y | - |
dc.contributor.author | Chung, I | - |
dc.date.accessioned | 2013-03-16T09:36:21Z | - |
dc.date.available | 2013-03-16T09:36:21Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-11-26 | - |
dc.identifier.citation | Thin Films: Stresses and Mechanical Properties IX, v.695, no., pp.245 - 250 | - |
dc.identifier.issn | 0272-9172 | - |
dc.identifier.uri | http://hdl.handle.net/10203/129934 | - |
dc.language | ENG | - |
dc.title | A study on the behavior of water absorption of SiOF thin films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition method | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0036352241 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 695 | - |
dc.citation.beginningpage | 245 | - |
dc.citation.endingpage | 250 | - |
dc.citation.publicationname | Thin Films: Stresses and Mechanical Properties IX | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Choi, Si-Kyung | - |
dc.contributor.nonIdAuthor | Kim, SP | - |
dc.contributor.nonIdAuthor | Park, Y | - |
dc.contributor.nonIdAuthor | Chung, I | - |
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