Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, TS | - |
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2013-03-16T07:33:54Z | - |
| dc.date.available | 2013-03-16T07:33:54Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05-28 | - |
| dc.identifier.citation | 52nd Electronic Components and Technology Conference, v., no., pp.979 - 984 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/128921 | - |
| dc.language | ENG | - |
| dc.title | Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0036292946 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 979 | - |
| dc.citation.endingpage | 984 | - |
| dc.citation.publicationname | 52nd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Park, TS | - |
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