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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages

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dc.contributor.authorKim, SH-
dc.contributor.authorKim, JY-
dc.contributor.authorYu, Jin-
dc.date.accessioned2013-03-16T07:07:02Z-
dc.date.available2013-03-16T07:07:02Z-
dc.date.created2012-02-06-
dc.date.issued2002-09-04-
dc.identifier.citation2002 International Symposium on Microelectronics, v.4931, no., pp.251 - 255-
dc.identifier.urihttp://hdl.handle.net/10203/128683-
dc.languageENG-
dc.titleInvestigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0036449994-
dc.type.rimsCONF-
dc.citation.volume4931-
dc.citation.beginningpage251-
dc.citation.endingpage255-
dc.citation.publicationname2002 International Symposium on Microelectronics-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorKim, SH-
dc.contributor.nonIdAuthorKim, JY-
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MS-Conference Papers(학술회의논문)
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