DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Novel resistive layer structure using via holes of an insulating interdielectric as a current path

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 309
  • Download : 0
Export
DC FieldValueLanguage
dc.contributor.authorHa J.K.-
dc.contributor.authorChung B.H.-
dc.contributor.authorHan S.Y.-
dc.contributor.authorChoi J.O.-
dc.contributor.authorKim, Ho Gi-
dc.date.accessioned2013-03-16T06:34:45Z-
dc.date.available2013-03-16T06:34:45Z-
dc.date.created2012-02-06-
dc.date.issued2000-08-14-
dc.identifier.citation13th International Vaccum Microelectronics Conference, v.19, no.3, pp.929 - 932-
dc.identifier.issn1071-1023-
dc.identifier.urihttp://hdl.handle.net/10203/128438-
dc.languageENG-
dc.titleNovel resistive layer structure using via holes of an insulating interdielectric as a current path-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0035326451-
dc.type.rimsCONF-
dc.citation.volume19-
dc.citation.issue3-
dc.citation.beginningpage929-
dc.citation.endingpage932-
dc.citation.publicationname13th International Vaccum Microelectronics Conference-
dc.identifier.conferencecountryChina-
dc.identifier.conferencecountryChina-
dc.contributor.localauthorKim, Ho Gi-
dc.contributor.nonIdAuthorHa J.K.-
dc.contributor.nonIdAuthorChung B.H.-
dc.contributor.nonIdAuthorHan S.Y.-
dc.contributor.nonIdAuthorChoi J.O.-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0