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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Phase transformation and residual stress evolution in electroless Ni-P UBM used in low cost flip chip technology

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dc.contributor.authorSong, JY-
dc.contributor.authorYu, Jin-
dc.date.accessioned2013-03-16T06:22:51Z-
dc.date.available2013-03-16T06:22:51Z-
dc.date.created2012-02-06-
dc.date.issued2002-09-04-
dc.identifier.citation2002 International Symposium on Microelectronics, v.4931, no., pp.261 - 266-
dc.identifier.urihttp://hdl.handle.net/10203/128360-
dc.languageENG-
dc.titlePhase transformation and residual stress evolution in electroless Ni-P UBM used in low cost flip chip technology-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0036452349-
dc.type.rimsCONF-
dc.citation.volume4931-
dc.citation.beginningpage261-
dc.citation.endingpage266-
dc.citation.publicationname2002 International Symposium on Microelectronics-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorSong, JY-
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MS-Conference Papers(학술회의논문)
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