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College of Engineering(공과대학)Dept. of Bio and Brain Engineering(바이오및뇌공학과)BiS-Conference Papers(학술회의논문)

Closed loop solder-lines on heated substrates

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dc.contributor.authorKim, SA-
dc.contributor.authorSeo, YH-
dc.contributor.authorCho, Young-Ho-
dc.contributor.authorKim, GH-
dc.contributor.authorPark, JY-
dc.contributor.authorBu, JU-
dc.date.accessioned2013-03-16T04:10:24Z-
dc.date.available2013-03-16T04:10:24Z-
dc.date.created2012-02-06-
dc.date.issued2002-05-28-
dc.identifier.citation52nd Electronic Components and Technology Conference, v., no., pp.1101 - 1105-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/127316-
dc.languageENG-
dc.titleClosed loop solder-lines on heated substrates-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0036296087-
dc.type.rimsCONF-
dc.citation.beginningpage1101-
dc.citation.endingpage1105-
dc.citation.publicationname52nd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorCho, Young-Ho-
dc.contributor.nonIdAuthorKim, SA-
dc.contributor.nonIdAuthorSeo, YH-
dc.contributor.nonIdAuthorKim, GH-
dc.contributor.nonIdAuthorPark, JY-
dc.contributor.nonIdAuthorBu, JU-
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BiS-Conference Papers(학술회의논문)
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