Mathematical model and thermal optimization of a miniature heat pipe with a grooved wick structure for electronic equipment cooling

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Issue Date
2001-07-08
Language
ENG
Citation

Pacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.2, pp.745 - 751

URI
http://hdl.handle.net/10203/126816
Appears in Collection
ME-Conference Papers(학술회의논문)
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