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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Microwave characterization and comparison of adhesive flip chip interconnects

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dc.contributor.authorKwon, WS-
dc.contributor.authorJeon, YD-
dc.contributor.authorLee, JH-
dc.contributor.authorNah, JW-
dc.contributor.authorYim, MJ-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-16T03:06:28Z-
dc.date.available2013-03-16T03:06:28Z-
dc.date.created2012-02-06-
dc.date.issued2001-07-08-
dc.identifier.citationPacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, no., pp.273 - 278-
dc.identifier.urihttp://hdl.handle.net/10203/126796-
dc.languageENG-
dc.titleMicrowave characterization and comparison of adhesive flip chip interconnects-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0346938589-
dc.type.rimsCONF-
dc.citation.volume1-
dc.citation.beginningpage273-
dc.citation.endingpage278-
dc.citation.publicationnamePacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKwon, WS-
dc.contributor.nonIdAuthorJeon, YD-
dc.contributor.nonIdAuthorLee, JH-
dc.contributor.nonIdAuthorNah, JW-
dc.contributor.nonIdAuthorYim, MJ-
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MS-Conference Papers(학술회의논문)
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