Chip scale package for SAW filter on the oxidized porous silicon using flip-chip bonding and Cu plated metal wall
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ha M.-L. | ko |
| dc.contributor.author | Lee J.-S. | ko |
| dc.contributor.author | Kwon, Young Se | ko |
| dc.date.accessioned | 2013-03-16T02:33:21Z | - |
| dc.date.available | 2013-03-16T02:33:21Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05-28 | - |
| dc.identifier.citation | 52nd Electronic Components and Technology Conference, pp.372 - 377 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/126523 | - |
| dc.language | English | - |
| dc.publisher | Electronic Components and Technology Conference | - |
| dc.title | Chip scale package for SAW filter on the oxidized porous silicon using flip-chip bonding and Cu plated metal wall | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000176683800060 | - |
| dc.identifier.scopusid | 2-s2.0-0036297015 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 372 | - |
| dc.citation.endingpage | 377 | - |
| dc.citation.publicationname | 52nd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.contributor.localauthor | Kwon, Young Se | - |
| dc.contributor.nonIdAuthor | Ha M.-L. | - |
| dc.contributor.nonIdAuthor | Lee J.-S. | - |
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