Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Heeseok | - |
| dc.contributor.author | Park C. | - |
| dc.contributor.author | Kam D. | - |
| dc.contributor.author | Kim, Joungho | - |
| dc.date.accessioned | 2013-03-16T02:30:38Z | - |
| dc.date.available | 2013-03-16T02:30:38Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05-12 | - |
| dc.identifier.citation | 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, v., no., pp.41 - 43 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/126504 | - |
| dc.language | ENG | - |
| dc.publisher | IEEE | - |
| dc.title | Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-46649096621 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 41 | - |
| dc.citation.endingpage | 43 | - |
| dc.citation.publicationname | 6th IEEE Workshop on Signal Propagation on Interconnects, SPI | - |
| dc.identifier.conferencecountry | Israel | - |
| dc.identifier.conferencecountry | Israel | - |
| dc.contributor.localauthor | Lee, Heeseok | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Park C. | - |
| dc.contributor.nonIdAuthor | Kam D. | - |
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