Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yim, Myung-Jin | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-16T02:25:19Z | - |
| dc.date.available | 2013-03-16T02:25:19Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-05-01 | - |
| dc.identifier.citation | 50th Electronic Components and Technology Conference, pp.899 - 905 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/126460 | - |
| dc.language | English | - |
| dc.publisher | Electronic Components and Technology Conference | - |
| dc.title | Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000088390200149 | - |
| dc.identifier.scopusid | 2-s2.0-0034482680 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 899 | - |
| dc.citation.endingpage | 905 | - |
| dc.citation.publicationname | 50th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Las Vegas, NV | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yim, Myung-Jin | - |
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