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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Nemerical Analysis of Coined Eutectic Solder Bumps

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorHwang, TK-
dc.contributor.authorNAH, JW-
dc.contributor.authorPaik, KW-
dc.date.accessioned2013-03-16T02:10:52Z-
dc.date.available2013-03-16T02:10:52Z-
dc.date.created2012-02-06-
dc.date.issued2002-
dc.identifier.citationKSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, v., no., pp.158 - 163-
dc.identifier.urihttp://hdl.handle.net/10203/126349-
dc.languageKOR-
dc.titleNemerical Analysis of Coined Eutectic Solder Bumps-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage158-
dc.citation.endingpage163-
dc.citation.publicationnameKSME 2002 Conference of Materials and Fracture Division,KSME 02MF025-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorHwang, TK-
dc.contributor.nonIdAuthorNAH, JW-
dc.contributor.nonIdAuthorPaik, KW-
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ME-Conference Papers(학술회의논문)
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