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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

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dc.contributor.authorKim, Joungho-
dc.contributor.authorKim, H.-
dc.contributor.authorJeong, Y.-
dc.contributor.authorLee, J.-
dc.contributor.authorKim, J.-
dc.date.accessioned2013-03-16T01:22:29Z-
dc.date.available2013-03-16T01:22:29Z-
dc.date.created2012-02-06-
dc.date.issued2002-05-12-
dc.identifier.citation6th IEEE Workshop on Signal Propagation on Interconnects, SPI, v., no., pp.23 - 26-
dc.identifier.urihttp://hdl.handle.net/10203/125975-
dc.languageENG-
dc.titleSlot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board-
dc.typeConference-
dc.identifier.scopusid2-s2.0-28444478584-
dc.type.rimsCONF-
dc.citation.beginningpage23-
dc.citation.endingpage26-
dc.citation.publicationname6th IEEE Workshop on Signal Propagation on Interconnects, SPI-
dc.identifier.conferencecountryItaly-
dc.identifier.conferencecountryItaly-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, H.-
dc.contributor.nonIdAuthorJeong, Y.-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorKim, J.-
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EE-Conference Papers(학술회의논문)
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