DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sung, M. | ko |
dc.contributor.author | Kim, N. | ko |
dc.contributor.author | Lee, J. | ko |
dc.contributor.author | Choi, B. | ko |
dc.contributor.author | Park, I. | ko |
dc.contributor.author | Hong, J.-K. | ko |
dc.contributor.author | Kwon, Y. | ko |
dc.contributor.author | Choi, K.S. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2013-03-16T00:52:08Z | - |
dc.date.available | 2013-03-16T00:52:08Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-10-29 | - |
dc.identifier.citation | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112 | - |
dc.identifier.uri | http://hdl.handle.net/10203/125735 | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Microwave frequency crosstalk model of redistribution line patterns on wafer level package | - |
dc.type | Conference | - |
dc.identifier.wosid | 000172924000027 | - |
dc.identifier.scopusid | 2-s2.0-0035699301 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 109 | - |
dc.citation.endingpage | 112 | - |
dc.citation.publicationname | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Cambridge, MA | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Sung, M. | - |
dc.contributor.nonIdAuthor | Kim, N. | - |
dc.contributor.nonIdAuthor | Lee, J. | - |
dc.contributor.nonIdAuthor | Choi, B. | - |
dc.contributor.nonIdAuthor | Park, I. | - |
dc.contributor.nonIdAuthor | Hong, J.-K. | - |
dc.contributor.nonIdAuthor | Kwon, Y. | - |
dc.contributor.nonIdAuthor | Choi, K.S. | - |
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