Microwave frequency crosstalk model of redistribution line patterns on wafer level package

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dc.contributor.authorSung, M.ko
dc.contributor.authorKim, N.ko
dc.contributor.authorLee, J.ko
dc.contributor.authorChoi, B.ko
dc.contributor.authorPark, I.ko
dc.contributor.authorHong, J.-K.ko
dc.contributor.authorKwon, Y.ko
dc.contributor.authorChoi, K.S.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2013-03-16T00:52:08Z-
dc.date.available2013-03-16T00:52:08Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2001-10-29-
dc.identifier.citationIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112-
dc.identifier.urihttp://hdl.handle.net/10203/125735-
dc.languageEnglish-
dc.publisherIEEE-
dc.titleMicrowave frequency crosstalk model of redistribution line patterns on wafer level package-
dc.typeConference-
dc.identifier.wosid000172924000027-
dc.identifier.scopusid2-s2.0-0035699301-
dc.type.rimsCONF-
dc.citation.beginningpage109-
dc.citation.endingpage112-
dc.citation.publicationnameIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationCambridge, MA-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorSung, M.-
dc.contributor.nonIdAuthorKim, N.-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorChoi, B.-
dc.contributor.nonIdAuthorPark, I.-
dc.contributor.nonIdAuthorHong, J.-K.-
dc.contributor.nonIdAuthorKwon, Y.-
dc.contributor.nonIdAuthorChoi, K.S.-
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