Effect of holes and edges on the squeeze film damping of perforated micromechanical structures
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Eung-Sam | ko |
| dc.contributor.author | Cho, Young-Ho | ko |
| dc.contributor.author | Kim, Moon-Uhn | ko |
| dc.date.accessioned | 2013-03-16T00:04:43Z | - |
| dc.date.available | 2013-03-16T00:04:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-01-17 | - |
| dc.identifier.citation | 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, pp.296 - 301 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/125366 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Effect of holes and edges on the squeeze film damping of perforated micromechanical structures | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000078743100053 | - |
| dc.identifier.scopusid | 2-s2.0-0032627176 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 296 | - |
| dc.citation.endingpage | 301 | - |
| dc.citation.publicationname | 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Orlando, FL | - |
| dc.contributor.localauthor | Cho, Young-Ho | - |
| dc.contributor.nonIdAuthor | Kim, Eung-Sam | - |
| dc.contributor.nonIdAuthor | Kim, Moon-Uhn | - |
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