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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Improved Copper Chemical Vapor Deposition Process by Applying Substrate Bias

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dc.contributor.authorPark, Chong-Ook-
dc.contributor.authorLee, Won-Jun-
dc.contributor.authorRha, Sa-Kyun-
dc.contributor.authorLee, Seung-Yun-
dc.contributor.authorKim, Dong-Won-
dc.contributor.authorChun, Soung-Soon-
dc.date.accessioned2013-03-15T21:19:10Z-
dc.date.available2013-03-15T21:19:10Z-
dc.date.created2012-02-06-
dc.date.issued1996-04-08-
dc.identifier.citation1996 MRS Spring Symposium, v.427, no., pp.207 - 212-
dc.identifier.issn0272-9172-
dc.identifier.urihttp://hdl.handle.net/10203/123993-
dc.languageENG-
dc.titleImproved Copper Chemical Vapor Deposition Process by Applying Substrate Bias-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.volume427-
dc.citation.beginningpage207-
dc.citation.endingpage212-
dc.citation.publicationname1996 MRS Spring Symposium-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPark, Chong-Ook-
dc.contributor.nonIdAuthorLee, Won-Jun-
dc.contributor.nonIdAuthorRha, Sa-Kyun-
dc.contributor.nonIdAuthorLee, Seung-Yun-
dc.contributor.nonIdAuthorKim, Dong-Won-
dc.contributor.nonIdAuthorChun, Soung-Soon-
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MS-Conference Papers(학술회의논문)
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