Vapor Pressure Analysis of Popcorn Cracking in Plastic IC Packages by Fracture Mechanics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Earmme, Youn-Young | ko |
| dc.date.accessioned | 2013-03-15T20:44:16Z | - |
| dc.date.available | 2013-03-15T20:44:16Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-12 | - |
| dc.identifier.citation | Electronics Packaging Technology Conference (EPTC), pp.36 - 42 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/123691 | - |
| dc.language | English | - |
| dc.publisher | EPTC | - |
| dc.title | Vapor Pressure Analysis of Popcorn Cracking in Plastic IC Packages by Fracture Mechanics | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000079964200008 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 36 | - |
| dc.citation.endingpage | 42 | - |
| dc.citation.publicationname | Electronics Packaging Technology Conference (EPTC) | - |
| dc.identifier.conferencecountry | SI | - |
| dc.identifier.conferencelocation | Singapore | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
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