Vapor Pressure Analysis of Popcorn Cracking in Plastic IC Packages by Fracture Mechanics

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 296
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorEarmme, Youn-Young-
dc.date.accessioned2013-03-15T20:44:16Z-
dc.date.available2013-03-15T20:44:16Z-
dc.date.created2012-02-06-
dc.date.issued1998-
dc.identifier.citationElectronics Packaging Technology Conference (EPTC), v., no., pp.36 - 42-
dc.identifier.urihttp://hdl.handle.net/10203/123691-
dc.languageENG-
dc.titleVapor Pressure Analysis of Popcorn Cracking in Plastic IC Packages by Fracture Mechanics-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage36-
dc.citation.endingpage42-
dc.citation.publicationnameElectronics Packaging Technology Conference (EPTC)-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorEarmme, Youn-Young-
Appears in Collection
ME-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0