DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, YB | - |
dc.contributor.author | Yu, Jin | - |
dc.date.accessioned | 2013-03-15T20:28:43Z | - |
dc.date.available | 2013-03-15T20:28:43Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1997-10-13 | - |
dc.identifier.citation | Proceedings of the 1997 21st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, v., no., pp.12 - 19 | - |
dc.identifier.uri | http://hdl.handle.net/10203/123564 | - |
dc.language | ENG | - |
dc.title | Fracture mechanics analysis of the popcorn cracking in the plastic IC packages | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0031362045 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 12 | - |
dc.citation.endingpage | 19 | - |
dc.citation.publicationname | Proceedings of the 1997 21st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Park, YB | - |
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