Peel Strength in the Cu/Cr/Polyimide System

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dc.contributor.authorYu, Jin-
dc.contributor.authorPark, IS-
dc.contributor.authorPark, YB-
dc.date.accessioned2013-03-15T20:10:16Z-
dc.date.available2013-03-15T20:10:16Z-
dc.date.created2012-02-06-
dc.date.issued1997-01-01-
dc.identifier.citationMat.Res.Soc.Symp. Proc., v.0, no.0, pp.133 - 138-
dc.identifier.urihttp://hdl.handle.net/10203/123415-
dc.languageENG-
dc.publisherMat. Res. Soc. Symp. Proc.-
dc.titlePeel Strength in the Cu/Cr/Polyimide System-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.volume0-
dc.citation.issue0-
dc.citation.beginningpage133-
dc.citation.endingpage138-
dc.citation.publicationnameMat.Res.Soc.Symp. Proc.-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorPark, IS-
dc.contributor.nonIdAuthorPark, YB-
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MS-Conference Papers(학술회의논문)
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