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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

A Parametric Study on the Thermal Fatigue Reliability of Flip Chip Solder Joints in Electronic Packaging

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dc.contributor.authorKim, JY-
dc.contributor.authorLee, Soon-Bok-
dc.date.accessioned2013-03-15T18:54:31Z-
dc.date.available2013-03-15T18:54:31Z-
dc.date.created2012-02-06-
dc.date.issued1996-
dc.identifier.citation1996 Int. Symposium on Experimental/numerical Mechanics in Electronic Packaging, v., no., pp.33 - 34-
dc.identifier.urihttp://hdl.handle.net/10203/122675-
dc.languageENG-
dc.titleA Parametric Study on the Thermal Fatigue Reliability of Flip Chip Solder Joints in Electronic Packaging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage33-
dc.citation.endingpage34-
dc.citation.publicationname1996 Int. Symposium on Experimental/numerical Mechanics in Electronic Packaging-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorKim, JY-
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ME-Conference Papers(학술회의논문)
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