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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection

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dc.contributor.authorLee, KWko
dc.contributor.authorKim, HJko
dc.contributor.authorYim, MJko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-03T05:37:01Z-
dc.date.available2007-09-03T05:37:01Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-05-30-
dc.identifier.citationIEEE 56th Electronic Components and Technology Conference, pp.918 - 923-
dc.identifier.urihttp://hdl.handle.net/10203/1225-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCuring and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection-
dc.typeConference-
dc.identifier.wosid000238566600141-
dc.identifier.scopusid2-s2.0-33845583525-
dc.type.rimsCONF-
dc.citation.beginningpage918-
dc.citation.endingpage923-
dc.citation.publicationnameIEEE 56th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorLee, KW-
dc.contributor.nonIdAuthorKim, HJ-
dc.contributor.nonIdAuthorYim, MJ-
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