Experimental Study for Solder Joint Reliability of Surface-Mounted Assembly Subjected to Mechanical Overload
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ham, SJ | - |
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2013-03-15T18:27:28Z | - |
| dc.date.available | 2013-03-15T18:27:28Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1997 | - |
| dc.identifier.citation | ASME Interpack, Advances in Electronic Packaging, v., no., pp.1593 - 1598 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/122425 | - |
| dc.language | ENG | - |
| dc.title | Experimental Study for Solder Joint Reliability of Surface-Mounted Assembly Subjected to Mechanical Overload | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1593 | - |
| dc.citation.endingpage | 1598 | - |
| dc.citation.publicationname | ASME Interpack, Advances in Electronic Packaging | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Ham, SJ | - |
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