DSpace at KOASAS: Residual Stress and Electrical Property with Deposition Parameter of Low Dielectric SiOF Thin Films Deposited by ECRCVD

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Residual Stress and Electrical Property with Deposition Parameter of Low Dielectric SiOF Thin Films Deposited by ECRCVD

Cited 0 time in webofscience

Cited 0 time in scopus

Hit : 357
Download : 0

Export

최시경 researcher / 김석필

Issue Date: 1997

Language: KOR

Citation: 추계 한국요업학회, pp.166 -

URI: http://hdl.handle.net/10203/122286

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: There are no files associated with this item.

Display Full Item Record

qr_code

트윗하기

KOASAS

Knowledge Service Development Team, KAIST 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea. T. 82-42-350-4493 Email. koasas@kaist.ac.kr
Copyright © 2016. Korea Advanced Institute of Science and Technology. All Rights Reserved.

KOASAS

KOASAS

Browse

Residual Stress and Electrical Property with Deposition Parameter of Low Dielectric SiOF Thin Films Deposited by ECRCVD

KOASAS

Communities & Collections