Residual Stress and Electrical Property with Deposition Parameter of Low Dielectric SiOF Thin Films Deposited by ECRCVD

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Issue Date
1997
Language
KOR
Citation

추계 한국요업학회, pp.166 -

URI
http://hdl.handle.net/10203/122286
Appears in Collection
MS-Conference Papers(학술회의논문)
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