DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications

Cited 5 time in webofscience Cited 0 time in scopus
  • Hit : 945
  • Download : 1836
Export
DC FieldValueLanguage
dc.contributor.authorYim, MJko
dc.contributor.authorKim, HJko
dc.contributor.authorChung, CKko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-03T05:17:45Z-
dc.date.available2007-09-03T05:17:45Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-05-30-
dc.identifier.citationIEEE 56th Electronic Components and Technology Conference, pp.338 - 343-
dc.identifier.urihttp://hdl.handle.net/10203/1221-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleDegradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications-
dc.typeConference-
dc.identifier.wosid000238566600051-
dc.identifier.scopusid2-s2.0-33845565393-
dc.type.rimsCONF-
dc.citation.beginningpage338-
dc.citation.endingpage343-
dc.citation.publicationnameIEEE 56th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorYim, MJ-
dc.contributor.nonIdAuthorKim, HJ-
dc.contributor.nonIdAuthorChung, CK-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 5 items in WoS Click to see citing articles in records_button

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0