A Measurement of the Interfacial Fracture Toughness between Chip and Lead frame
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Earmme, Youn-Young | - |
| dc.date.accessioned | 2013-03-15T17:04:13Z | - |
| dc.date.available | 2013-03-15T17:04:13Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998 | - |
| dc.identifier.citation | International Conference on Electronic Materials, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/121619 | - |
| dc.language | ENG | - |
| dc.title | A Measurement of the Interfacial Fracture Toughness between Chip and Lead frame | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Conference on Electronic Materials | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.